Canteliver Probe Card
MPI Cantilever Probe Card is extensively applied on gold bump and pad wafer testing for Display screen driver, logic, and memory system. MPI’s cantilever probes tend to be the corresponding remedy to the needs of fine pitch, compact pad dimension, substantial speed, less cleaning, multi-DUT, significant pin count, and extremely-minimal leakage demands. With excellent craftsmanship, ground breaking architecture and verified methodologies dependant on mechanical and electrical simulation/measurement outcomes, creating MPI the very best cantilever company globally.
FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to attain the semiconductor ship manufacture time-to-current market (TTM) and value of test (COT) demand. FCB is actually a confirmed solution for a number of semiconductor output exams from early engineering pilot-operates to superior volume producing (HVM). FCB is ready for device demanding substantial sign integrity probing (SI) and/or electric power integrity probing (PI). Applications involve cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the entire world’s very best overall Value-of-possession (COO) for numerous DUT apps.
EVS Probe Card
The EVS Probe Card is an enhancement about the conventional buckling beam probe card. Critical attributes are increased present-day carrying capacity (C.C.C.) and reduced balanced Speak to force (BCF), along with Total MEMS-like properties. EVS can easily satisfy the necessity of Innovative wafer probing. Specific alignment and fantastic planarity control will be the essential components contributing to steady Make contact with resistance. With its capability and functionality, EVS Probe Card is a super option for State-of-the-art probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to desire for ever finer pitch. It is suitable for scaled-down Al pad, and is also ideal for little pitch application with peripheral and complete array sample. With precise alignment and better planarity Command, Osprey can arrive at increased efficiency by multi-DUT layout. The forming wire (FW) kind needle produced with MPI’s possess micro fabrication procedure not simply delivers superior-good quality overall performance but will also permits easy needle substitute and shortens protecting cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle that is created for the desire of small force probing. Furthermore, it comes along with the ability to satisfy substantial C.C.C. and significant pin counts software. The MEMS method makes sure hugely constant needle characteristics, plus the Distinctive structure style enables precise alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and click here Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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